Impact of aluminum wire and ribbon bonding technologies on D2PAK package reliability during thermal cycling applications
نویسندگان
چکیده
منابع مشابه
Arjmand, E. and Agyakwa, P.A. and Johnson, C.M. (2014) Reliability of thick Al wire: a study of the effects of wire bonding parameters on thermal cycling degradation
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples were prepared with 25 different designs with 5 different bonding parameters such as time, ultrasonic power, beginforce, end-force and touch-down steps (pre-compression) with 5 levels. The bond signals of ultrasonic generator were collected during bonding in order to obtain prior quality informatio...
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ورودعنوان ژورنال:
- Microelectronics Reliability
دوره 55 شماره
صفحات -
تاریخ انتشار 2015